PACK EXPO INTERNATIONAL 2021, CHICAGO, USA

PACK EXPO INTERNATIONAL 2021, CHICAGO, USA
SEPTEMBER 27 - 29, 2021 / CHICAGO, USA

Maripak will be presenting its latest technologies to the customers at Pack EXPO International Packaging Fair, Chicago, USA, which will take place on 27-29 SEPTEMBER 2021.

In 2018, 2500 companies and 45.000 exhibitors attended this fair which is held every two years in Chicago.

We will be proud to see you among us in this fair which we will attend for the second time in 2021.