PACK EXPO INTERNATIONAL 2020, CHICAGO, USA
Maripak will be presenting its latest technologies to the customers at Pack EXPO International Packaging Fair, Chicago, USA, which will take place on 8-11 NOVEMBER 2020.
In 2018, 2500 companies and 45000 exhibitors attended this fair which is held every two years in Chicago.
We will be proud to see you among us in this fair which we will attend for the second time in 2020.
Visit us at our booth in Lower Lakeside 10328.